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General
Specifications
CKG Series – Mega Cap Type Capacitors
No.
8
Item
Bending
Performance
No mechanical damage.
Test or Inspection Method
Reflow solder the capacitor on P.C. board (shown in
Appendix 2) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
9
Solderability
Both end faces and the contact areas
shall be covered with a smooth and
bright solder coating with no more than
a small amount of scattered
imperfections such as pinholes or un-
wetted or de-wetted areas.
Reflow solder the capacitors on P.C board (shown in
Appendix 1).
Solder: H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
These imperfections shall not be
concentrated in one area.
Characteristics
10
Temperature Cycle
External
appearance
Capacitance
No mechanical damage.
Change from the
value before test
X5R
Reflow solder the capacitors on P.C. board (shown in
Appendix 1) before testing.
Expose the capacitors in the condition step1 through
step 4 and repeat 100 times consecutively.
Leave the capacitors in ambient condition for 24 ± 2h
before measurement.
X7R
X7S
X7T
± 7.5 %
Step
1
2
Temperature (oC)
Min. operating temp. ± 3
Reference Temp. ± 2
Time (min.)
30 ± 3
2–5
D.F.
Insulation
Resistance
Meet the initial spec.
Meet the initial spec.
3
4
Max. operating temp. ± 2
Reference Temp. ± 2
30 ± 2
2-5
Voltage Proof
No insulation breakdown or other
damage.
TDK MLCC US Catalog
Page 282
Version B11
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